DIRIS Eigenschaften
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DIRIS powered by X-SPEX – is once again an exhibitor at the Embedded World exhibition from 27th february to 1st of March in Nuremberg!

DE_H_1_S_481

Obtain free visitor tickets with X-SPEX voucher code B376916

selected products (see details below)

B02-Board HAL ***NEW!*** B02-Board SD X-CAM***NEW!*** ZPBC2 IO-Adapters

DIRIS – Industrial Quality OEM Video Systems

Optimize video capabilities and reliability of your product with reduced complexity!

The company X-SPEX is developer and manufacuturer of the “DIRIS“ OEM video system. This is a collection of components for recording, processing, transmitting/streaming, and playing of video and audio for industrial grade applications. Control of DIRIS system can be performed either by buttons+LEDs and/or serial interface and/or network (incl. WIFI and/or UMTS/LTE). DIRIS systems for OEM customers are easy to manage and easy to integrate into products and applications.

At the Embedded World 2018 exhibition X-SPEX presents enhanced functions of the DIRIS B02-Boards

  • Inputs: analog, HDMI/DVI, HD-SDI, Camera Link, BCON (supplier Basler)
  • Konfigurable zoom
  • Text overlay
  • Simultaneous output to HDMI monitor and LVDS display
  • Individualization/branding (grafics, text, font, …) can be performed by OEM-Kunden themselves

Configurations options of the DIRIS B02-Boards comprise perfectly matched interfaces for product integration. Typical individual components are NOT needed, like display controller und text generator.
Du to the small size of just 100 mm * 80 mm the DIRIS B02-Board ist well suited for integration into small products.

Application areas are industrial, medical, security, traffic applications and others.

DIRIS Product Groups

  • DIRIS-Board compact PCB (multiple sizes) for housing integration into customers products
  • DIRIS-Box independent, stand-alone devices with standard interfaces
  • ZP moduls autonomous battery management for batteries and SuperCaps
  • IO adapters standard sockets with ESD protection for rapid prototyping and simple product integration
  • cables for internal and external connections, …

The modular concept of the DIRIS OEM video platform enables customer specific variations of standard products.

DIRIS Product Features

DIRIS B02-Board provide the enhanced functions stated above plus the following general features …

  • 3 resolution classes: SD to FullHD
  • low propagation delay of 100 ms max. from video input to output (0 ms with 0-Delay option)
  • Various storage options: internal, SD-card, USB, SATA
  • Video recording in H.264-format
  • JPG pictures during the video recording (also Picture-In-Picture-Mode)
  • stereo audio, incl. microphone and headphone amplifier
  • Auto-Split – Automatic splitting of long shots
  • Pre-Trigger – record up to 60 seconds from the past
  • real time clock (RTC) with configurable video overlay format
  • State information as a display overlay
  • direct connection of LVDS display
  • 2x PWM+EN for brightness control of camera light and display backlight
  • (remote) control at the device and/or serial interface and/or IP network (WIFI and UMTS/LTE option)
    • Touch operation on display
    • Connection of 4 buttons (resp. 2x buttons plus rotary encoder) for control
    • Connection of 2x 2-Color LED (memory and status) and 1x LED (power) for status signaling
  • configuration by menu, file or interface
  • Software update by storage device or network
  • Input voltage 5..24(36) V
  • temperature range -20..+80 °C (-40..85°C optional)
  • careful layout for high signal integrity and very good EMI properties

“MADE IN GERMANY“ – development and production in Germany!

X‑SPEX, Hall 1 Stand 481

Contact: Raymond Horn

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Selected Products

5 selected products can be presented at the online exhibitor presentation of the Embedded World exhibition.

Please find additional informationen on all DIRIS products here.

DIRIS B02-Board HAL – Digital HD Video (HDMI/DVI, CameraLink, BCON) *** NEW! ***

Foto von IO-Board B02
DIRIS B02-Board all standard ports assembled

The DIRIS B02-Board HAL is a versatile video recorder board with digital video interfaces.
It comprises multiple interface options and provides all general features of DIRIS products documented part of the company information.

Special features of DIRIS B02-Board HAL:

  • Size: 100 mm * 80 mm, height approx. 25 mm (depending on selected interfaces)
  • External interfaces with standard socket at one PCB edge
    all interfaces alternatively available on FPC/ZIF for device internal assembly
  • Different video inputs up to 1,920 x 1,080 (depending on product variant):
    HDMI/DVI, Camera-Link, BCON; analog input formats
  • Different video outputs up to 1,920 x 1,200 (depending on product variant):
    HDMI/DVI, LVDS display (18 und 24 bit); analog output formats
    concurrent operation of LVDS display (1,280 x 800) and HDMI/DVI (1,280 x 720)
  • Audio usable with line IO, PC headset (2x audio jacks) or phone headset (1x audio jack)
  • Serial UART interface available as LVTTL, RS232, RS422 or RS485

 

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DIRIS B02-Board AL with standard sockets

Foto von DIRIS B02-Board
DIRIS B02-Board – Variant with CVBS and S-Video plus Audio

The DIRIS B02-Board AL is a versatile video recorder board with analog video interfaces.
It comprises multiple interface options and provides all general features of DIRIS products documented part of the company information.

Special features of DIRIS B02-Board AL:

  • Size: 100 mm * 80 mm, height approx. 25 mm (depending on selected sockets)
  • External interfaces with standard sockets on one PCB edge
    all interfaces alternatively available on FPC/ZIF for device internal assembly
  • Different analog video inputs (depending on product variant):
    CVBS + S-Video (PAL/NTSC), YPbPr (component), VGA/RGB

    up to 800 x 600 (VGA/RGB) and 1,280 x 720 (YPbPr)
  • Different analog video outputs (depending on product variant):
    CVBS + S-Video (PAL/NTSC), YPbPr (component), VGA/RGB

    up to 1,280 x 720 (VGA/RGB and YPbPr)
  • Adressing of LVDS display (18/24 bit, single channel up to 1280×800)
  • Audio usable with line IO, PC headset (2x audio jacks) or phone headset (1x audio jack)
  • Serial UART interface available as LVTTL, RS232, RS422 or RS485

 

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X-CAM – Camera Module with Microphone and Light Control ** NEW! **

X-CAM
camera module X-CAM

Small and robust camera module, that can be detached up to 10 m from the central unit by a thin cable.

Special features of the camera module X-CAM:

  • Just 30 x 40 mm² PCB size; camera with light just 46 x 44 x 16 mm³ (smaller variants planned)
  • 5 MPixel CMOS Sensor 1/2,5“; NIR capable
    RGB or black/white
  • 5..15 V; 1,5W max. (4,5..16,5 V max.)
  • Optional microphone (stereo)
  • Optional up to 2x buttons and 1x two-color LED
  • Optional integration of a camera light (white or IR) with PWM control (16 KHz) with 1,024 levels
  • attached cable with robust industrial plug
    extension cable as accessories available
  • Operation with DIRIS B02-Board XCAM
  • pixel synchronous recording with multiple camera modules (with DIRIS B02-Board Multi)

Accessory: ZPBC2 for transparent use of LiO/LiFePO4 batteries

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„ZPBC2A“ – LiO/LiFePO4 battery controller

The ZPBC2 is a µC driven management module for LiO/LiFePO4 battery packs with 2 to 4 cells. ZPBC2 is connected as a T-piece among the power supply, battery and the device. It either works completely autonomous or communicates with the device.

special features of ZPBC2 battery management:

  • size: 65 mm x 26 mm
  • charge current = 2,5A (versions with 5,0 A und 7,5 A planed)
  • stand-by power: approx. 1 mA oder 0.0 mA (2 variants)
  • configuration by UART from PC, e.g. max. input and charge currents
  • temperature range: -20 bis +80°C

 

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Accessory: IO-Adapters with standard sockets (with EMI filters and ESD protection)

IO-Adapter examples: Power + SD-card + Audio + Video

IO-Adapters connect internal pin headers or ZIF/FPC sockets of DIRIS-Boards to the external world providing standard sockets. All cables needed for those connections are available as accessories too.

special features of IO-Adapter:

  • uniform/regular dimensions
    Width 30, 40 mm, 50 mm, 60 mm, 80 mm oder 100 mm
    outer holes to inner holes always 20 mm distance
  • all attachments M2,5
  • internal ports FPC/ZIF or assembled cables with 2,00 mm Pitch (assembly option)
    power-connection with 3 mm Pitch (up to 5 A)
  • high signal quality provided by careful layout
  • Special EMV and ESD-concept
    • careful layout
    • ESD protection through TVS diodes and high voltage-capacitor against ext.GND (Earth)
    • EMI tolerance through ferrits (and filters)
    • outer attachments = ext.GND (Earth); inner attachments = System-GND

Special variants on customers request, e.g. 50 cm long connection for SD-Cards.
 

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